Measuring school climate in the era of industrial revolution 4.0: a statistical analysis

Kamarul Shukri, Mat Teh and Raihan, Mohd Arifin and Rosdi, Zakaria (2020) Measuring school climate in the era of industrial revolution 4.0: a statistical analysis. Journal of Physics: Conference Series, 1529 (4). pp. 1-7. ISSN 1742-6596

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Abstract

School climate is a key factor in shaping a student's identity. The fourth industrial revolution has been a hot topic in addressing today's student challenges. Today's reality shows that human resource development is a major focus of organizations in addressing environmental change. Social problem symptoms are often caused by demotivate environment among secondary students. The school climate has a great impact on student self-esteem. This is not only for oneself but for the organization as a whole, including humanity and the unity of ummah. The main objective of the study is to investigate the influence of school climate on student self-esteem based on the strategies and practices used at the school. This quantitative approach employs survey design using questionnaire as a research instrument. A total of 368 respondents from religious secondary schools were tested using descriptive and inferential statistics. The correlation between variebal physical enviroment, community and leadership were tested. The study found that school climate has a significant impact on student self-esteem. Then regression analysis was used to predict the contribution from each variebal. The contribution of this study is obvious as the resulting outcomes can be capitalized as guidelines as the level of student achievement influence by high school climate implementation. Therefore, school climate studies should be conducted in order to establish a concept that can be used by all types of schools in Malaysia to create a good identity. The implications of this study are to shape the good generation who are ready to complement their individual capabilities in addressing the challenging industry 4.0 challenges.

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